Polar Parts

Ships to CanadaPrices in CAD

MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 1
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 2
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 3
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 4
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 5
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 6
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 7
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 8
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 9
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 10
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools image 11
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Brand: MECHANIC

MECHANIC Sn63/Pb37 Solder Paste, 183°C, 20-38μm, XGZ40 and XGSP Series, for BGA and SMD Repair

$9.06

Est. delivery 6–12 days

Est. $3.13 shipping to Canada. Exact cost at checkout

In stock

Supplier stock is confirmed when your order is processed.

Option: XGSP30
Quantity
Sold by
Polar Parts
Ships from
Our supplier partnersSupport from Milton, Ontario
Shipping
Canada only
Returns
14 days, unopened items
Payment
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Specifications

Model NumberXGZ40/XGSP30/XGSP40/XGSP50/XGSP80
OriginMainland China
Particle Size20-38μm
Melting Point183℃
Gross Weight20g/35g/42g/60g
UsageBGA Rework Tools
IngredientsSn63/Pb37
StyleSoldering tin paste

About this item

Description provided by the supplier. Our shipping, returns and support terms apply.

Leaded Sn63/Pb37 solder paste that melts at 183°C, for BGA, SMD and phone board repair, in several MECHANIC models.

MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 Soldering Welding Tin Paste for Mobile Phone IC CPU BGA SMD Phone Repair Tools Specification : --Brand : MECHANIC. --Model : XGZ40/XGSP30/XGSP40/XGSP50/XGSP80. --Type : Tin Paste. --Weight : 20g/35g/42g/60g. --Microns : 20-38um. --Melting Point : 183℃. --Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing. --WARNING: This product can expose you to chemicals including lead, which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go towww.P65Warnings.ca.gov. Package : 1 • Solder Paste

Shipping & returns

Delivery
Estimated delivery: 6–12 days to Canadian addresses. Estimates aren't guaranteed. Tracking is shared when available.Shipping policy
Shipping cost and tax
Estimated at $3.13 from a supplier quote. The exact cost is quoted live for your Canadian address at checkout, with sales tax, so you see the full total before you pay.
Returns
Unopened, unused items in resalable condition can be returned within 14 days of delivery. Some items are excluded.Refund policy
Questions before you order?
Ask about fit, compatibility or bulk quantities.[email protected]Contact support

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