Polar Parts

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Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 1
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 2
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 3
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 4
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 5
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 6
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 7
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 8
Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair image 9
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Sn63Pb37 Leaded Solder Paste 183°C Syringe Solder Paste 20g 35g 50g Optional for BGA Reballing Phone PCB Repair

$14.48

Est. delivery 7–15 days

Est. $3.13 shipping to Canada. Exact cost at checkout

In stock

Supplier stock is confirmed when your order is processed.

Option: Sn63Pb37-20g / 1pcs
Quantity
Sold by
Polar Parts
Ships from
Our supplier partnersSupport from Milton, Ontario
Shipping
Canada only
Returns
14 days, unopened items
Payment
Secure checkout

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Specifications

PackageSyringe Tube / Needle Tube Type
ApplicationBGA Chip Reballing, Mobile Phone Repair
CertificationREACH
CertificationRoHs
OriginMainland China
Particle Size20-38μm
Does the product contain Bi？No
AlloySn63Pb37 Leaded Alloy

About this item

Description provided by the supplier. Our shipping, returns and support terms apply.

This Sn63Pb37 leaded solder paste adopts classic Sn63Pb37 alloy with melting point at 183°C. Designed in syringe tube for convenient dispensing. It features stable viscosity, smooth flow and great wetting performance, forming bright and firm solder joints. Widely used for BGA chip reballing, mobile phone maintenance, PCB circuit board and various precision electronic component soldering. Multiple specifications 20g,35g,50g for your choice. Core Parameters Alloy: Sn63Pb37 Leaded Alloy Melting Point: 183°C / 361°F Package: Syringe Tube / Needle Tube Type Available Weight: 20g / 35g / 50g Optional Grain Size: 20-38μm Application: BGA Chip Reballing, Mobile Phone Repair, PCB Soldering, Precision Electronic Components Soldering Product Features Stable Viscosity, Smooth & Even Flow Excellent Wettability Bright & Firm Solder Joints Easy Dispensing, Convenient Operation

Shipping & returns

Delivery
Estimated delivery: 7–15 days to Canadian addresses. Estimates aren't guaranteed. Tracking is shared when available.Shipping policy
Shipping cost and tax
Estimated at $3.13 from a supplier quote. The exact cost is quoted live for your Canadian address at checkout, with sales tax, so you see the full total before you pay.
Returns
Unopened, unused items in resalable condition can be returned within 14 days of delivery. Some items are excluded.Refund policy
Questions before you order?
Ask about fit, compatibility or bulk quantities.[email protected]Contact support

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